Thermal compound is necessary to create a reliable transfer of heat from your computer’s
processor to its heatsink to keep your CPU from overheating. This thermal grease can be
used on the rear side of the heatsink which has no thermal pad. It will improve the heat
disipation of your processor.
The Pluscom thermal transfer compound improves the effectiveness of CPU coolers by thermally
bonding the CPU to the heatsink. This ensures that the heatsink and fan can work at their
full capacity to remove the harmful heat away from the CPU, and prevent burnout or heat damage.
Professional grade thermal paste
Comes in syringe style tube for accurate and easy application
A good thermal compound that does the job very efficiently
Ideal for 360’s, Processors, Heatsinks CPU’s GPU’s and other component devices
Type: Silicone Fluid with 20% Metal Oxide
Thermal conductivity: >1.829 W/m-k
Thermal resistance: >0.123 C-in2/w
Dielectric Breakdown: >5.0 KV ac
Size: 6.5″ x 1.5″(L*W)